Handling, Packing, Shipping and Use of Moisture/Reflow Sensitive Surface Mount Devices

This training describes the standardized levels of floor life exposure for

moisture/reflow-sensitive SMD packages along with the handling, packing and

shipping requirements necessary to avoid moisture/reflow-related failures.

Moisture from atmospheric humidity enters permeable packaging materials by

diffusion.

Training Topics Include:  

• Understand the moisture sensitivity of a package influencing the following
• factors:
• Internal dimensions and design of the lead frame
• The external dimension of the package
• Physical properties of the die attach material and mold compound
• Die dimensions
• Process control
• Methodology
• The methodology offers an effective combination of lectures, case studies, walk-
• thru, videos and class participation activities conducted by knowledgeable and
• experienced instructors who are leaders in their fields.