StudentscomponentsSessionsthe Students will learn how to produce the best industry method in soldering. The student will be able to identify and rectify inferior solder joints based on IPC 610 requirements. This course will also guide the students to select and prepare the correct soldering tools and eventually master component installation and removal techniques based on the IPC 7711 method.
At the completion of the course, the student will be able to identify faulty connections and terminations and repair them to an acceptable industry standard.
Training Topics Include:
Chapter 1: Basic Understanding of Soldering
Chapter 2: Soldering Methodology
- Through Hole Technology (PTH).
- Chip Components and Gull-wing the components, small outline transistors
(SOTs), small outline integrated circuits (SOICs), quad flat packs(QFPs).
Chapter 3: Inspection Criteriaver the inspection criteria for Through Hole Technology (PTH) and Chip and Gull Wing components. Throughout this session, the student will able to perform inspection based in IPC class 1, 2 & 3 criteria.
Chapter 4: Practical Session
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BTE TRAINING & ELECTRONICS PLT (LLP 0010350-LGN)
BUMI TRAINING & ELECTRONICS ENTERPRISE (PG0353759-P)
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