This program's education and training aims to increase the accuracy of distinguishing between "acceptable" and "unacceptable" electronic printed circuit board assembly as defined by the latest IPC-A-610 Rev. series.
Training Topics Include:
- Introduction/IPC Professional Policies and Procedures Module 2 (required)
- Foreword, Applicable Documents, & Handling Module 3 (optional)
- Hardware Installation Module 4 (optional)
- Soldering (Including High Voltage) Module 5 (optional)
- Terminal Connections (Requires Modules 4 & 8 prior) Module 6 (optional)
- Through-Hole Technology (Including TH Jumper Wires) (Requires Modules 4 & 8 before taking this module) Module 7 (optional)
- Surface Mount Assemblies (Including SMT Jumper Wires) (Requires Modules 4 & 8 before taking this module) Module 8 (optional)
- Component Damage and Printed Circuit Boards and Assemblies Module 9 (optional)
- Solderless Wire Wrap